Dimensional Analysis and Fpga-Based Implementation for Real-Time Thickness and Conductivity Estimation in Eddy Current Testing

In quality control systems, the accurate and efficient measurement of material properties, such as thickness and electrical conductivity, is crucial to ensure product quality and process reliability. This paper presents a novel approach that combines the computational efficiency of Field-Programmable Gate Arrays (FPGAs) with the well-celebrated Buckingham's π theorem (dimensional analysis) to address these measurement challenges. By leveraging dimensional analysis, the proposed method reduces the complexity of parameter estimation in Eddy Current Testing (ECT) by systematically eliminating redundant variables, enabling real-time processing with minimal computational overhead. The FPGA hardware implementation exploits its parallel processing capabilities to achieve high-speed data acquisition and parameter extraction, even within constrained computational resources, and seamlessly integrates into Industry 4.0 quality control systems. Experimental results demonstrate the accuracy and robustness of the FPGA solution with respect to classical implementations, as well as its superior processing speed and efficiency.