LAHBACHA, Khitem
LAHBACHA, Khitem
Dipartimento di Ingegneria Elettrica e dell'Informazione "Maurizio Scarano"
Electrothermal Analysis of Memristors and Thermistors
2022-07-14 Lahbacha, Khitem
Guidelines for the Design of Thin Film Microstrip Lines for Signal Integrity Analysis
2024-01-01 Lahbacha, Khitem; Ngoc Phung, Gia; Dao Pham, Thi; Arz, Uwe; DI CAPUA, Giulia; Maffucci, Antonio; Miele, Gianfranco; Allal, Djamel
Measurement and Analysis of On-Wafer Test Structures for Signal Integrity Assessment at Chip Level
2024-01-01 Pham, T. D.; Ngoc Phung, G.; Lahbacha, K.; Maffucci, A.; Miele, G.; Arz, U.; Allal, D.
Measurement-Based Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines
2024-01-01 Lahbacha, K.; Di Capua, G.; Miele, G.; Maffucci, A.; Chiariello, A. G.; Pham, T. D.; Allal, D.
Recommendations for the Design of Differential Thin-Film Microstrip Lines
2023-01-01 Phung, G. N.; Arz, U.; Pham, T. D.; Allal, D.; Lahbacha, K.; Miele, G.; Maffucci, A.
RF Measurements for Future Communication Applications: an Overview
2022-01-01 Allal, D.; Bannister, R.; Buisman, K.; Capriglione, D.; Di Capua, G.; Garcia-Patron, M.; Gatzweiler, T.; Gellersen, F.; Harzheim, T.; Heuermann, H.; Hoffmann, J.; Izbrodin, A.; Kuhlmann, K.; Lahbacha, K.; Maffucci, A.; Miele, G.; Mubarak, F.; Salter, M.; Pham, T. D.; Sayegh, A.; Singh, D.; Stein, F.; Zeier, M.
Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines (TFMSLs)
2023-01-01 Lahbacha, K.; Di Capua, G.; Miele, G.; Maffucci, A.; Pham, T. D.; Allal, D.; Phung, G. N.; Arz, U.
Thermal and Signal Integrity Improvement in a 3D RRAM Crossbar with Carbon Nanotube Interconnects
2023-01-01 Lahbacha, K.; Zayer, F.; Belgacem, H.; Dghais, W.; Maffucci, A.
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| Electrothermal Analysis of Memristors and Thermistors | 14-lug-2022 | Lahbacha, Khitem | |
| Guidelines for the Design of Thin Film Microstrip Lines for Signal Integrity Analysis | 1-gen-2024 | Lahbacha, Khitem; Ngoc Phung, Gia; Dao Pham, Thi; Arz, Uwe; DI CAPUA, Giulia; Maffucci, Antonio; Miele, Gianfranco; Allal, Djamel | |
| Measurement and Analysis of On-Wafer Test Structures for Signal Integrity Assessment at Chip Level | 1-gen-2024 | Pham, T. D.; Ngoc Phung, G.; Lahbacha, K.; Maffucci, A.; Miele, G.; Arz, U.; Allal, D. | |
| Measurement-Based Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines | 1-gen-2024 | Lahbacha, K.; Di Capua, G.; Miele, G.; Maffucci, A.; Chiariello, A. G.; Pham, T. D.; Allal, D. | |
| Recommendations for the Design of Differential Thin-Film Microstrip Lines | 1-gen-2023 | Phung, G. N.; Arz, U.; Pham, T. D.; Allal, D.; Lahbacha, K.; Miele, G.; Maffucci, A. | |
| RF Measurements for Future Communication Applications: an Overview | 1-gen-2022 | Allal, D.; Bannister, R.; Buisman, K.; Capriglione, D.; Di Capua, G.; Garcia-Patron, M.; Gatzweiler, T.; Gellersen, F.; Harzheim, T.; Heuermann, H.; Hoffmann, J.; Izbrodin, A.; Kuhlmann, K.; Lahbacha, K.; Maffucci, A.; Miele, G.; Mubarak, F.; Salter, M.; Pham, T. D.; Sayegh, A.; Singh, D.; Stein, F.; Zeier, M. | |
| Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines (TFMSLs) | 1-gen-2023 | Lahbacha, K.; Di Capua, G.; Miele, G.; Maffucci, A.; Pham, T. D.; Allal, D.; Phung, G. N.; Arz, U. | |
| Thermal and Signal Integrity Improvement in a 3D RRAM Crossbar with Carbon Nanotube Interconnects | 1-gen-2023 | Lahbacha, K.; Zayer, F.; Belgacem, H.; Dghais, W.; Maffucci, A. |