Signal Integrity Analysis and Measurement of Thin Film Microstrip Lines (TFMSLs)

This paper investigates Thin-Film Microstrip Lines (TFMSLs) for high-frequency and high-data-rate applications, including fifth-generation (5G) communication systems. Two test structures with varying spacings (Dsignall and Dsignal2) are analyzed in the frequency domain using mixed-mode S-parameters for both differential and common modes, validated against measurement results to confirm the accuracy of the circuit models. Time-domain analyses, based on eye diagram metrics, evaluate the signal integrity of high-speed data link systems. The study provides design maps offering specific insights into optimizing TFMSL configurations and receiver setups to ensure reliable signal transmission in high-speed digital systems.