IRIS

LAHBACHA, Khitem

LAHBACHA, Khitem  

Dipartimento di Ingegneria Elettrica e dell'Informazione "Maurizio Scarano"  

Mostra records
Risultati 1 - 17 di 17 (tempo di esecuzione: 0.031 secondi).
Titolo Data di pubblicazione Autore(i) File
Electro-Thermal Parameters of Graphene Nano-Platelets Films for De-Icing Applications 1-gen-2022 Lahbacha, K.; Sibilia, S.; Trezza, G.; Giovinco, G.; Bertocchi, F.; Chiodini, S.; Cristiano, F.; Maffucci, A.
Electrothermal analysis of 3D memristive 1D-1RRAM crossbar with carbon nanotube electrodes 1-gen-2019 Zayer, F.; Lahbacha, K.; Dghais, W.; Belgacem, H.; De Magistris, M.; Melnikov, A. V.; Maffucci, A.
Electrothermal Analysis of Memristors and Thermistors 14-lug-2022 Lahbacha, Khitem
Electrothermal RRAM Crossbar Improvement with 3-D CRS and 1D1R-1R1D Architectures 1-gen-2021 Lahbacha, K.; Belgacem, H.; Dghais, W.; Zayer, F.; Maffucci, A.
Guidelines for the Design of Thin Film Microstrip Lines for Signal Integrity Analysis 1-gen-2024 Lahbacha, Khitem; Ngoc Phung, Gia; Dao Pham, Thi; Arz, Uwe; DI CAPUA, Giulia; Maffucci, Antonio; Miele, Gianfranco; Allal, Djamel
High Density RRAM Arrays with Improved Thermal and Signal Integrity 1-gen-2021 Lahbacha, K.; Belgacem, H.; Dghais, W.; Zayer, F.; Maffucci, A.
Measurement and Analysis of On-Wafer Test Structures for Signal Integrity Assessment at Chip Level 1-gen-2024 Pham, T. D.; Ngoc Phung, G.; Lahbacha, K.; Maffucci, A.; Miele, G.; Arz, U.; Allal, D.
Measurement-Based Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines 1-gen-2024 Lahbacha, K.; Di Capua, G.; Miele, G.; Maffucci, A.; Chiariello, A. G.; Pham, T. D.; Allal, D.
Performance Enhancement of Large Crossbar Resistive Memories with Complementary and 1D1R-1R1D RRAM Structures 1-gen-2021 Lahbacha, K.; Zayer, F.; Belgacem, H.; Dghais, W.; Maffucci, A.
Recommendations for the Design of Differential Thin-Film Microstrip Lines 1-gen-2023 Phung, G. N.; Arz, U.; Pham, T. D.; Allal, D.; Lahbacha, K.; Miele, G.; Maffucci, A.
Reliable 3D 1D1R-1R1D solution for victim layers in monolithic RRAM integration 1-gen-2020 Lahbacha, K.; Zayer, F.; Dghais, W.; Maffucci, A.; Belgacem, H.
RF Measurements for Future Communication Applications: an Overview 1-gen-2022 Allal, D.; Bannister, R.; Buisman, K.; Capriglione, D.; Di Capua, G.; Garcia-Patron, M.; Gatzweiler, T.; Gellersen, F.; Harzheim, T.; Heuermann, H.; Hoffmann, J.; Izbrodin, A.; Kuhlmann, K.; Lahbacha, K.; Maffucci, A.; Miele, G.; Mubarak, F.; Salter, M.; Pham, T. D.; Sayegh, A.; Singh, D.; Stein, F.; Zeier, M.
Signal and Thermal Integrity Analysis of 3-D Stacked Resistive Random Access Memories 1-gen-2021 Fakhreddine, Z.; Lahbacha, K.; Melnikov, A.; Belgacem, H.; De Magistris, M.; Dghais, W.; Maffucci, A.
Signal Integrity Analysis and Measurement of Thin Film Microstrip Lines (TFMSLs) 1-gen-2025 Lahbacha, Khitem; Maffucci, Antonio; Di Capua, Giulia; Miele, Gianfranco; Chiariello, Andrea Gaetano; Pham, Thi Dao; Allal, Djamel
Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines (TFMSLs) 1-gen-2023 Lahbacha, K.; Di Capua, G.; Miele, G.; Maffucci, A.; Pham, T. D.; Allal, D.; Phung, G. N.; Arz, U.
Thermal and Signal Integrity Analysis of Novel 3D Crossbar Resistive Random Access Memories 1-gen-2019 Zayer, F.; Lahbacha, K.; Dghais, W.; Belgacem, H.; De Magistris, M.; Maffucci, A.; Melnikov, A. V.
Thermal and Signal Integrity Improvement in a 3D RRAM Crossbar with Carbon Nanotube Interconnects 1-gen-2023 Lahbacha, K.; Zayer, F.; Belgacem, H.; Dghais, W.; Maffucci, A.