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EnglishThis paper addresses the problem of scaling interconnects to nanometric dimensions in future very-large-scale integration applications. Traditional copper interconnects are compared to innovative interconnects made by bundles of metallic carbon nanotubes. A new model is presented to describe the propagation of electric signals along carbon nanotube (CNT) bundles, in the framework of the classical transmission line theory. A possible implementation of a future scaled microstrip based on CNT bundle is analyzed and compared to a conventional microstrip.
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| Titolo: | Performance Comparison Between Metallic Carbon Nanotube and Copper Nano-interconnects |
| Autori: | |
| Data di pubblicazione: | 2008 |
| Rivista: | |
| Abstract: | This paper addresses the problem of scaling interconnects to nanometric dimensions in future very-large-scale integration applications. Traditional copper interconnects are compared to innovative interconnects made by bundles of metallic carbon nanotubes. A new model is presented to describe the propagation of electric signals along carbon nanotube (CNT) bundles, in the framework of the classical transmission line theory. A possible implementation of a future scaled microstrip based on CNT bundle is analyzed and compared to a conventional microstrip. |
| Handle: | http://hdl.handle.net/11580/9411 |
| Appare nelle tipologie: | 1.1 Articolo in rivista |
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