A surface integral formulation is used for a broad-band characterization of wire interconnects. A suitable definition of effective impedance accounts for the penetration of currents and charges inside lossy conductors. The results are successfully compared to a volumetric integral approach.
Titolo: | Broad-band Characterization of Wire Interconnects Using a Surface Integral Formulation with a Surface Effective Impedance |
Autori: | |
Data di pubblicazione: | 2008 |
Rivista: | |
Abstract: | A surface integral formulation is used for a broad-band characterization of wire interconnects. A suitable definition of effective impedance accounts for the penetration of currents and charges inside lossy conductors. The results are successfully compared to a volumetric integral approach. |
Handle: | http://hdl.handle.net/11580/9349 |
Appare nelle tipologie: | 1.1 Articolo in rivista |
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