A surface integral formulation is used for a broad-band characterization of wire interconnects. A suitable definition of effective impedance accounts for the penetration of currents and charges inside lossy conductors. The results are successfully compared to a volumetric integral approach.

Broad-band Characterization of Wire Interconnects Using a Surface Integral Formulation with a Surface Effective Impedance

MAFFUCCI, Antonio;VENTRE, Salvatore;VILLONE, Fabio;
2008-01-01

Abstract

A surface integral formulation is used for a broad-band characterization of wire interconnects. A suitable definition of effective impedance accounts for the penetration of currents and charges inside lossy conductors. The results are successfully compared to a volumetric integral approach.
File in questo prodotto:
Non ci sono file associati a questo prodotto.

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11580/9349
 Attenzione

Attenzione! I dati visualizzati non sono stati sottoposti a validazione da parte dell'ateneo

Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 0
social impact