CINECA IRIS Institutional Research Information System
IRIS è la soluzione IT che facilita la raccolta e la gestione dei dati relativi alle attività e ai prodotti della ricerca. Fornisce a ricercatori, amministratori e valutatori gli strumenti per monitorare i risultati della ricerca, aumentarne la visibilità e allocare in modo efficace le risorse disponibili.
EnglishThe paper deals with the modeling of the parasitic resistance of nanopackaging interconnects. Two kinds of material are considered: conventional (copper) and innovative (carbon nanotubes). Both of them are modeled taking into account the effects of temperature and size, both playing a relevant role in nanopackaging. Simple but physicallymeaningful models for carbon nanotubes are proposed, based on the concept of the number of conducting channel and on the evaluation of the mean free path. The comparison between the materials is made with reference to a 30 μm-pitch pillar bump, proposed as chip-to-package interconnect.
Scheda prodotto non validato
Attenzione! I dati visualizzati non sono stati sottoposti a validazione da parte dell'ateneo
| Titolo: | Electrical and Thermal Behaviour of Nanopackaging Interconnects with Conventional and Innovative Materials |
| Autori: | |
| Data di pubblicazione: | 2010 |
| Abstract: | The paper deals with the modeling of the parasitic resistance of nanopackaging interconnects. Two kinds of material are considered: conventional (copper) and innovative (carbon nanotubes). Both of them are modeled taking into account the effects of temperature and size, both playing a relevant role in nanopackaging. Simple but physicallymeaningful models for carbon nanotubes are proposed, based on the concept of the number of conducting channel and on the evaluation of the mean free path. The comparison between the materials is made with reference to a 30 μm-pitch pillar bump, proposed as chip-to-package interconnect. |
| Handle: | http://hdl.handle.net/11580/6438 |
| ISBN: | 9781424476091 |
| Appare nelle tipologie: | 4.1 Contributo in Atti di convegno |
File in questo prodotto:
http://hdl.handle.net/11580/6438
Copyright © 2021