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EnglishIn this paper we study the electrical and thermal behaviour of future on-chip interconnects, where carbon nanotube bundles are assumed to replace conventional materials in realizing vertical vias. The model adopted here describe the bundles through a circuit equivalent representation, whose parameters takes into account the effect of size, chirality and temperature of the carbon nanotubes. This allows modelling accurately the typical operating conditions for on-chip interconnects. A 12-layer on-chip interconnect is analysed here, referred to the 22 nm technology node, and three possible scenarios are compared: a conventional copper realization and two hybrid realizations, where the horizontal traces are made by copper or by graphene nanoribbons.
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| Titolo: | Modeling carbon nanotube bundles for future on-chip nano-interconnects |
| Autori: | |
| Data di pubblicazione: | 2011 |
| Abstract: | In this paper we study the electrical and thermal behaviour of future on-chip interconnects, where carbon nanotube bundles are assumed to replace conventional materials in realizing vertical vias. The model adopted here describe the bundles through a circuit equivalent representation, whose parameters takes into account the effect of size, chirality and temperature of the carbon nanotubes. This allows modelling accurately the typical operating conditions for on-chip interconnects. A 12-layer on-chip interconnect is analysed here, referred to the 22 nm technology node, and three possible scenarios are compared: a conventional copper realization and two hybrid realizations, where the horizontal traces are made by copper or by graphene nanoribbons. |
| Handle: | http://hdl.handle.net/11580/21881 |
| ISBN: | 9781467322881 |
| Appare nelle tipologie: | 4.1 Contributo in Atti di convegno |
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http://hdl.handle.net/11580/21881
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