Special Section dedicated to the latest advancements and technological developments in the design methodologies for modern-day chip-package system integration.
Foreword: Special Section on "Novel Design Methodologies to Address the Challenges of Modern-Day Chip-Package-System Integration"
Maffucci A.
Supervision
;
2025-01-01
Abstract
Special Section dedicated to the latest advancements and technological developments in the design methodologies for modern-day chip-package system integration.File in questo prodotto:
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2025_foreword_special_issue_TCMPT_jan.pdf
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